Image Sensors for Sensing
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Overview
We have commercialized a Time of Flight(ToF) image sensor by combining ToF sensing technology and the pixel technology for mobile CMOS image sensors backed by years of expertise.
With its accurate depth-sensing capability of measuring the distance to the target, this product significantly improves the quality of imaging experience with a smartphone as the sensor enables precise autofocus, bokeh effect and other camera features. It can also be used for security applications by utilizing it for facial recognition.
Applying this to the 3D spatial recognition or gesture recognition will facilitate useful and fun applications, such as AR gaming and new-style spatial communication, to contribute to the creation of new value for smartphone users.
The trends of creating players’ avatars and 3D spatial recognition will stimulate the advancement of features in VR head-mount displays and AR glasses, which will grow in demand with the diffusion of the metaverse.
Bokeh effect of background
AR Occlusion
Features
dToF, which is capable of measurement at long distances, and iToF, which provides high speed and high image resolution
ToF image sensors measure the distances to a target object by emitting light from a source, usually a laser or LED, and detecting the reflected light, based on the time elapsed between the two.
There are broadly two types of ToF.
Direct ToF (dToF)
This simply measures the time between the emission of light and detection of the reflected light. The pixels adopt SPAD (single photon avalanche diode), in which an array of pixels amplify electrons from a single incident photon using the avalanche multiplication, thus capable of detecting even a faint light. This enables the measurement of longer distances.
Indirect ToF (iToF)
This measures distances by accumulating the reflected light in each pixel and detecting the phase differences. This style can adapt the conventional CMOS image sensor structures, without needing specialized pixels such as SPAD, and deliver high resolution 3D images of the target object.
Realizing modules with lower power consumption and smaller sizes
The light collection efficiency has been improved by leveraging the superior advantages of the back-illuminated structure, placing the metal wiring behind the photodiodes. High light-collecting efficiency enables to reduce light source output, realizing smaller modules with lower power consumption, which is vital for mobile components.
Product Lineup
| Model | IMX611 | IMX518 | IMX316 |
|---|---|---|---|
| Features | A dToF sensor with high photon-detection capability through a unique pixel structure. See here for detailed descriptions of the products. |
An iToF sensor with high efficiency and VGA resolution capability through a unique pixel structure. | An iToF sensor in a smaller size with HQVGA resolution capability through a unique pixel structure. |
| Effective pixels | 140 × 170 pixels, 0.023 Megapixels | 640 × 480 pixels, 0.3 Megapixels | 240 × 180 pixels, 0.043 Megapixels |
| Image size | 2.2 mm diagonal (type 1/8.1) | 4.0 mm diagonal (type 1/4.5) | 3.0 mm diagonal (type 1/6) |
| Pixel size | 10.08 × 10.08 µm | 5 × 5 µm | 10 × 10 µm |
Technology
ToF (Time of Flight) - Find more technical information about the ToF (Time of Flight) used in this product category.
Applications
This page describes use cases of the image sensors for mobile sensing applications.
Related Links
Image Sensors for Mobile "LYTIA"
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