SPAD ToF Depth Sensor
1/2.9" 0.1MP IMX560

Capable of long-range 3D sensing

SPAD ToF depth sensors have a mechanism of avalanche-multiplying electrons when photons hit, and amplifies the photons detected for conversion to powerful signals. This allows faint light signals returning over long distances to be detected with high accuracy. Sensors of this type can measure more than a few dozen meters ahead and are capable of grasping 3D conditions in a wider area than the indirect ToF (iToF) sensor type. It can be used to detect objects in a wide area, such as AGVs and AMRs that autonomously travel while sensing for obstacles ahead, and for safety light curtains which protect people moving around in a specific area by identifying in advance any risk of entry.

High resolution

SPAD ToF depth sensors are equipped with on-chip time-to-digital converters (TDCs) and are capable of digital output. By implementing a layered design and arranging many TDCs in parallel, Sony has achieved high resolution with the capability to measure multiple points simultaneously. This improves object recognition accuracy.

Depth sensing system resistant to multi-path interference

For accurate distance measurement, it is important to remove signals reflected in unintended paths against the signal emitted from the camera's light source and reflected on the target just once before reaching the sensor. In particular, concave shapes such as the corner of a room tend to cause signal light in unintended paths, which may result in erroneously measured values. The depth sensing algorithm of the SPAD ToF depth sensor measures the distance to the object several times and statistically processes the measurement results of each point acquired. This allows high-accuracy and low-noise data to be stably acquired and provides the capability of distortion-free measurement, even of corners. This leads to improved reliability of measurement and expectations for ensured accuracy in various applications.

Compact and designed for easy system integration

Sony’s proprietary pixel technologies nurtured in CMOS image sensor development have been used to incorporate SPAD pixels and a depth-sensing processing circuit into a single chip. This achieves high resolution with a compact size, and allows the LiDAR structure to be simplified. This is ideal for applications requiring low power consumption, compactness, and adaptability. By integrating these capabilities into a single chip, it also helps lower the cost of LiDAR.