Sony Semiconductor Solutions Corporation (SSS) participated in Advanced Packaging and Chiplet Summit (APCS) 2023, held at the Tokyo Big Sight convention center in Japan from 13th to 15th December.
At our booth, we conducted live demonstrations using actual devices, including the new SWIR image sensor IMX992 and the UV image sensor IMX487.
Demonstration footage will be shared via video in January 2024 with everyone who subscribes to the e-mail newsletter. Please take this opportunity to sign up. (Click here to subscribe to the e-mail newsletter*1)
＜Exhibition content＞
SSS’s exhibition booth appearance
SSS’s demonstration area
UV image sensor demonstration
Inspection of surface scratch
on silicon wafer using the IMX487
SWIR image sensor demonstration
Observing through silicon wafers
using the new product IMX992
Products and technologies related to the exhibited products can be viewed from the links below.
<Related products>
■ SWIR image sensor IMX992 / IMX993
■ SWIR image sensor IMX990 / IMX991
■ UV image sensor IMX487
<Related technologies>
■ Image sensors for industrial use
■ Short Wavelength Infra-Red Image Sensor Technology SenSWIR™
■ Ultraviolet (UV) Image Sensor Technology
■ Global Shutter Technology Pregius™ / Pregius S™
*1 The e-mail newsletter features products and technologies, events, services, and other information about image sensors for industrial and security cameras. It is published two or three times a month.
* Pregius, Pregius S, SenSWIR and the logos are registered trademarks or trademarks of Sony Group Corporation or its affiliates.